Tempow Launches Partnership Program for Chipset Manufacturers to Accelerate Adoption of Bluetooth LE Audio

By In The News
January 7, 2020 in The Headlines

Recommended Posts

In The News

Posted January 7, 2020

- Share

Posted January 7, 2020

LAS VEGAS, Jan. 6, 2020 /PRNewswire/ -- Tempow, creators of software-only solutions to enhance core Bluetooth protocol, today announced the release of a new Bluetooth Software Stack for hearables and speakers, with an early prototype of the freshly revealed LE Audio, the next generation...

View the full article

Link to comment

Share on other sites

Archived

This topic is now archived and is closed to further replies.

Go to topic listing

Most Contributions
1. In The News
  219872
2. Jaydee
  16753
3. Kip Powick
  12211
4. deicer
  12196
5. dagger
  9595
Tell a friend
Love The Airline Website? Tell a friend!
- Email
- Share
Forum Statistics
- Total Topics
  
  270.1k
- Total Posts
  
  558.6k

Sign In

Tempow Launches Partnership Program for Chipset Manufacturers to Accelerate Adoption of Bluetooth LE Audio

Recommended Posts

In The News

Link to comment

Share on other sites

Archived

Most Contributions

Tell a friend

Forum Statistics

Browse

Activity

Support